How To Use SMT Adapter Modules for Superior IC Package deal Transitioning

For many years, semiconductor producers have developed built-in circuits (ICs) as surface-mount gadget (SMD) packages. The commonest surface-mount know-how (SMT) package deal varieties for DC-DC converters, op amps, and plenty of different circuits embody small-outline built-in circuit (SOIC), thin-shrink small define package deal (TSSOP) and small-outline transistor (SOT).

Newer processes and manufacturing applied sciences resembling 300mm wafers have enabled higher-performing units with extra elements per wafer. These advances have led to the manufacturing of ICs at larger volumes than legacy ICs.

Together with elevated volumes, Texas Devices (TI) manufactures and assembles many more moderen units at a number of websites, which is called “twin sourced.” Twin-source manufacturing and meeting make it simpler to maneuver current system designs to newer units, since there’s extra throughput, flexibility and reliability within the provide chain.

Efficiency and Longevity

Maybe probably the most easy technique for growing the longevity of a product is to extend its efficiency by updating the ICs with newer, better-performing units. This technique helps speed up the event cycle on the design and verification degree as a result of the designer already is aware of that almost all of the system works and can make comparatively minor modifications, thus simplifying the product’s recharacterization or recertification.

Otherwise you is perhaps motivated to maneuver to a brand new gadget era due to improved efficiency. In 2004, TI launched the LMC7211-N push-pull output comparator. However with the latest launch of the corporate’s TLV1811 comparator, it’s doable to enhance general system efficiency by evaluating the newer gadget in place.

For instance, the TLV1811 has improved specs that make it a possible alternative for the LMC7211-N. The TLV1811 employs a extra superior IC course of and has a rail-to-rail enter/output, a 40 V provide vary and a decrease offset voltage. Its working temperature vary extends to 125°C, versus 85°C for the LMV7211-N.
 

Desk 1. TLV1811 vs. LMC7211-N specification comparability

Saving Time and Value

In functions the place there’s a restricted quantity of board house, value sensitivity or each, it is perhaps essential to transition to a smaller and extra economical gadget all through a system’s lifetime. An instance of this might be transitioning from the OPA171 operational amplifier in an SOIC package deal to the OPA991 operational amplifier within the SC-70 package deal. As Determine 1 reveals, the SC-70 physique measurement is greater than six occasions smaller than the SOIC, leading to on the spot house financial savings.

Determine 1. OPA171 SOIC package deal vs. the OPA991 SC-70 package deal

Newer manufacturing capabilities and course of enhancements have enabled drastic die-size reductions of semiconductor units that allow producers to supply them in smaller packages beforehand unavailable.

Transitioning to Newer Packages With no Redesign

Whether or not the explanation to maneuver to a special gadget is to make the most of an up to date course of know-how, efficiency, measurement or value, one widespread impediment when updating units is the dearth of drop-in replacements. For operational amplifiers, for instance, this problem arises in packages with extra pins for shutdown, resembling a 16-pin SOIC package deal and a 16-pin TSSOP.

For instance, the TI TLV2775 is a quad-channel operational amplifier with shutdown performance obtainable in each 16-pin SOIC and TSSOP. Whereas newer units proceed to help the no-shutdown 14-pin SOIC and TSSOP, they hardly ever provide the shutdown variants in SOIC and TSSOP, which makes it tougher for engineers to maneuver to newer units.

TI’s TLV9054S is a good selection for an improve. Nevertheless, this quad-channel shutdown operational amplifier is barely obtainable within the very skinny quad flat no-lead (16-pin WQFN) package deal.

Three Troublesome Choices

Till not too long ago, for those who needed to exchange the TLV2775 with the TLV9054S, you had three choices:

• Possibility #1: Spin a brand new board to guage a component that you just haven’t examined but.
• Possibility #2: Construct a simplified circuit on an analysis module to guage.
• Possibility #3: “Lifeless bug” or “blue wire”-solder your gadget to your board.

TI’s surface-mount adapter analysis modules (EVMs) provide another for designers. These adapter EVMs present financial savings in each engineering time and price by enabling the analysis of a alternative gadget in a system. Possibility #1, listed above, is dear and time-consuming, choice #2 might not offer you a whole image of gadget efficiency, and choice #3 introduces parasitic losses and might be virtually unimaginable with smaller units.

As Determine 2 reveals, the surface-mount adapter EVM goes immediately on the present printed circuit board and adapts the 16-pin SOIC to the 16-pin WQFN gadget below analysis. The surface-mount adapter EVMs present a definite benefit to evaluating one other gadget by minimizing sources spent to guage that the gadget will work in your product earlier than transitioning over.
 

Determine 2. Changing the 16-pin SOIC to a WQFN package deal

Just like the 16-pin SOIC package deal and 16-pin TSSOP, single-channel SOIC packages in older units such because the LMC7211-N and OPA171 should not obtainable within the next-generation variations of those units (the TLV1811 and OPA991, respectively). There are numerous newer packages not obtainable in previous-generation units that present a really compact resolution, however wouldn’t be simple to guage merely.

4 Floor-Mount Adapter EVM Selections

New surface-mount adapter EVMs can be found in 4 package deal variations:

• The eight-pin SOIC adapter EVM (Determine 3)
• The eight-pin very skinny shrink small-outline package deal (VSSOP) and TSSOP adapter EVM (Determine 4)
• The quad (14-/16-pin) TSSOP adapter EVM (Determine 5)
• The quad (14-/16-pin) SOIC adapter EVM (Determine 6)

TI designed every variation to transform footprints of bigger legacy packages into their next-generation successors.

Determine 3. SOIC adapter EVM

Determine 4. VSSOP TSSOP adapter EVM

Determine 5. Quad TSSOP adapter EVM

Determine 6. Quad SOIC adapter EVM. (Click on picture to enlarge)

Ease Your Engineering Efforts

Updating and upgrading units was once a frightening problem. Earlier strategies of both spinning a brand new board earlier than testing the brand new gadget, constructing out a simplified circuit on an EVM, or blue wiring the gadget all come on the expense of money and time. Floor-mount adapter EVMs will help you decrease engineering effort and save prices by supplying you with the choice to guage new units in current designs.

If concerned with studying easy methods to use and ordering a number of of those floor mount adapter boards in your system, they are often ordered from TI’s Floor Mount Adapter EVM web page.

All photographs used courtesy of Texas Devices

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