Toshiba Digital Gadgets & Storage Company (“Toshiba”) has launched “TLP3475W,” a photorelay in a small, skinny WSON4 bundle. It reduces insertion loss and suppresses energy attenuation in high-frequency alerts and is appropriate for the pin electronics of semiconductor testers, which use numerous relays and require high-speed signaling. Quantity shipments begin at present.
Toshiba’s optimized bundle designs reduces parasitic capacitance and inductance within the new photorelay. This reduces insertion loss and improves the transmission attribute of high-frequency alerts to 20GHz (typ.), about 1.5 occasions decrease than Toshiba’s present product, TLP3475S.
TLP3475W makes use of a small, skinny WSON4 bundle that’s solely 0.8mm (typ.) thick, making it the smallest photorelay within the trade to comprehend improved high-frequency sign transmission traits. It’s 40% decrease in top than Toshiba’s ultra-small S-VSON4T bundle, permitting extra merchandise to be mounted on the identical circuit board, and can contribute to improved measuring effectivity.
Toshiba will proceed to develop its product line-up to assist semiconductor testers that ship larger speeds and higher performance.
Purposes
- Semiconductor testers (high-speed reminiscence testers, high-speed logic testers, and so on.)
- Probe playing cards
- Measuring tools
Options
- Trade’s smallest WSON4 bundle: 1.45mm×2.0mm (typ.), t=0.8mm (typ.)
- Enhancing to go the high-frequency alerts : f=20GHz (typ.) @Insertion loss(S21) = -3dB
- Usually open perform (1-Kind-A)